FOR PROFESSIONAL USE
Unlike most so called overclocking motherboards that are designed by engineers who don't have adequate experience in extreme overclocking or have never participated in an OC event, Z590 OC Formula is the only motherboard in the market that is designed by a genuine overclocker, Nick Shih, who is hands down one of the most talented overclockers alive.
HIGHER AND HIGHER SPEED
Using only specially selected performance components, this masterpiece pushes the Z590 platform to its extreme limits.
Overclockers who are dead serious about breaking limits should look no further than the ASRock Z590 OC Formula.
16 POWER PHASE DESIGN with 90A SPS
SPS (SMART POWER STAGE) is a new power solution with fully optimized integrated MOSFETs with advanced driver IC, current sensors and temperature sensors, which provides current monitoring and more stable current for extreme overclocking!
SMD TYPE DIMM
Compares to conventional DIP style DIMM slot, SMD type DIMM slot can reduce signal loss, improves stability under high frequency and maximize overclocking potential.
12 LAYERS SERVER-GRADE LOW-LOSS PCB
The 12 layers server grade PCB prevents PCB bending and improves signal integrity, giving higher performance as well as system stability, giving a reliable and long-lasting system without any compromise.
An array of OC friendly buttons with varies of function to help overclockers achieve the world record!
An OLED display was added to give a cleaner and informative way to express the status of the motherboard, the content can also be configured in the BIOS for more user friendly application.
Z590 OC Formula features a unique “PCB Backdrill” craftsmanship by removing the excess stub in multilayered printed wiring boards, this benefits in extreme memory overclocking by allowing signal to flow from layer to another with less signal attenuation and improves impedance matching.
ESS 9218 DAC & WIMA AUDIO CAPS
Embrace the audio stunning performance with ESS 9218 SABRE DAC & WIMA Audio caps. True Hi-Fi Audio, no distorted digital signal to support higher impedance up to 600 Ω headphone.
Whether you are using headphones, a headset, external or internal speakers, via USB, Wi-Fi, analog output or even HDMI, Nahimic Audio offers you the most engaging listening experience, vibrant and rich with details.
USB 3.2 GEN2x2
FRONT USB 3.2 GEN2X2 & Dual USB 3.2 Gen2 (Type-A + Type-C)
Delivers up to 20 Gbps data transfer rate which is 2x as fast as previous generation, providing a blazing fast data transfer interface with reversible USB Type-C design.
Dual USB 3.2 Gen2 (Type-A + Type-C)
This motherboard has a pair of onboard Type-A and Type-C USB 3.2 Gen2 ports built on the rear i/o for supporting next generation USB 3.2 Gen2 devices and to deliver up to 10 Gbps data transfer rates.
WiFi 6E (802.11AX)
WiFi 6E technology has extended to the whole new 6GHz spectrum band, providing more WiFi capability and giving an even better and faster internet traf c. In addition to deliver higher speeds, the WiFi 6E also enhances the lower latency and supports service levels that are equivalent to 5G networks.
* The availability of Wi-Fi 6E (6GHz) may vary between different countries.
Optimized for Water Cooling
XXL Aluminum Alloy Heatsink with Active FAN Design
XXL Aluminum Alloy Heatsink design with active fan that effectively improve heat dissipation and promotes overall performance. This is aimed for die hard gamers and enthusiasts to bring a new computing experience paired with Intel’s 11th Gen processors.
PCI Express 4.0 Ready
UNBEATABLE HEATSINK ARMOR WITH HYPER M.2 (GEN4 X4)
Forged with aluminum alloy heatsink top cover that effectively improves heat dissipation. Underneath is the next generation PCI Express 4.0 Hyper M.2 Socket, with twice the transfer speed of the previous 3rd Generation.
Reinforced Steel Slot [PCIe 4.0 Version]
The reinforced steel slot comes with the various benefits including extra anchor points, stronger latch, ensure signal stability and make sure heavy graphics cards to be well-installed.
Strengthens the motherboard to prevent bending caused by heavy coolers or graphics cards with better airflow and enhanced stability.