The Ryzen 7000 Delid-Die-Mate is a tool for removing the heatspreaders ("delidding") on AMD Ryzen 7000/8X00G/9000 processors. By removing the heatspreader, the CPUs can be cooled via "Direct-Die", for example. With the so-called "Direct Die" method, the CPU cooler is mounted directly on the CPU dies and the I/O die of the processor. By omitting the heatspreader in the cooling circuit, a significantly optimised heat transfer from the die to the CPU cooler is possible.
- Compatible with Ryzen 7000/8X00G/9000 CPUs
- Delidding tool
- Made from aluminium
Why "Delidding" & Direct-Die Method on Ryzen 7000?
Delidding is the process of removing the processor's heatspreader. On unsoldered processors, delidding is usually used to replace the thermal interface material (TIM) between the CPU die and the heatspreader with high-quality thermal paste or liquid metal before the heatspreader is remounted.
However, as the Ryzen 7000 processors are soldered, this is not an option as removing the indium solder would create too large a gap between the IHS and CPU dies.
Therefore, the Ryzen 7000 CPUs are primarily delidded for possible mounting of the CPU cooler directly on the CPU dies. In the case of Ryzen 7000 CPUs, this would be the I/O die (IOD) and one or two CPU dies (CCDs), so called chiplets. By omitting the heatspreader and mounting the CPU cooler directly on the die, experience shows that temperatures can be reduced by 10-20°C if liquid metal such as Conductonaut is used as TIM. Corresponding tests were carried out by the content creators and Tech-YouTubers Roman "der8auer" Hartung, a professional overclocker and engineer, and Jason "JayzTwoCents" Langevin.
These enormous temperature improvements through Direct Die are due, among other things, to the heatspreader of the Ryzen 7000 processors. The heatspreaders for the AM5 platform, introduced with Ryzen 7000, are thicker than older heatspreaders, such as AM4. This was done to make older CPU coolers compatible with AM4 also compatible with the AM5 platform. In addition, the surface area of the Ryzen 7000 heatspreaders is significantly smaller at approx. 910 mm² compared to AM4 with 1,300 mm².
Since the chiplets of the Ryzen CPU could possibly be damaged when the CPU cooler is mounted using the Direct Die method, as has happened with old AMD processors of the Athlon XP generation, among others, we offer the Ryzen 7000 Direct Die Frame. This covers the edges of the PCB and reduces the risk of damage when mounting the CPU cooler on the Dies.
Compatibility Note:
The Ryzen 7000 Delid-Die-Mate is compatible with the APUs of the Ryzen 8000G series as well as the CPUs of the Ryzen 9000 series, including the X3D variants.
