The NH-D15 G2 is the further improved second generation of Noctua’s iconic NH-D15. With its state-of-the-art, speed-offset NF-A14x25r G2 PWM fans, eight heatpipes and asymmetrical fin-stacks that have been carefully fine-tuned to work in tandem with the new fans, it achieves even better quiet cooling performance than its award-winning predecessor. As such, the G2 version is a true flagship model that continues the legacy of the original NH-D15 by pushing the boundaries of air cooling and rivalling the efficiency of many all-in-one (AIO) water cooling solutions. Optimised for strongly concave CPUs, the specialised High Base Convexity (HBC) version provides excellent contact quality on Intel LGA1700 processors that are used with full ILM pressure or have become permanently deformed in long-term use. In addition to its further improved performance, the NH-D15 G2 also offers enhanced compatibility thanks to an offset construction that allows it to clear the top PCIe x16 slot on most current motherboards. Last but not least, the G2 version has been upgraded to the Torx®-based SecuFirm2+™ multi-socket mounting system with included NM-SD1 screwdriver as well as to Noctua’s superior NT-H2 thermal compound. In short, the NH-D15 G2 has been further refined in virtually all respects from the heatsink and the fans all the way down to the mounting, thermal paste and accessory package. Topped off with Noctua’s trusted 6-year manufacturer’s warranty, it’s the new number one choice for customers who demand the best of the best in air cooling.

Taking platform-specific optimisation to a new level, the NH-D15 G2 is available in a regular, standard version and two specialised variants:

• The regular NH-D15 G2 is our standard recommendation. It uses the same medium base convexity as most other Noctua heatsinks, which makes it a perfect all-rounder that provides optimal results on AM5 with the included offset mounting and on LGA1700 CPUs when utilising the included NM-ISW1 shim washers (or so-called contact frames) to reduce CPU deformation from ILM pressure.
• The HBC (High Base Convexity) variant is specifically optimised for LGA1700 processors that are used with full ILM pressure or have become permanently deformed in long-term use, providing excellent contact quality despite the CPU’s concave shape.
• The LBC (Low Base Convexity) variant is specifically optimised for relatively flat CPUs. As such, it offers excellent contact quality on AMD AM5 even without the offset mounting as well as on other comparably flat CPUs (e.g. AM4, LGA2066, LGA2011, lapped or custom flat heatspreaders, etc.).

In chassis with more than 168mm CPU cooler clearance, the front fan can be moved upwards to make room for memory modules taller than 32mm.