Increase Thermal Conduction Efficiency

AP3 increases thermal performance by improving the CPU and Heatsink base contact surface. AP3 is easy to apply and remove and does not damage the application surface.

Filling in the Blanks

AP3 has excellent malleability which allows it to easily fill in the microscopic gaps of the metal surfaces on the CPU and heatsink base for added surface contact area. This is key to high thermal efficiency.

Easy to Spread & Use

The included thermal paste spread tool makes it extremely easy to apply AP3 correctly and safely with no hazard to the application surface.

Super Long Lasting

Made with high quality materials only, AP3's composite thermal material delivers long lasting stable thermal performance.