The rumor and speculation mills were going full force last week as many suspected that Intel could begin the permanent bonding of their CPU's with motherboards. As you may (should) already know, current CPU offerings use the LGA (land grid array) mounting format, with pins, sockets and interchangeable CPU's that allow you to upgrade your hardware and swap faulty components. Intel has said it will not make the switch to BGA (ball grid array) chips for the foreseeable future, which basically means Intel don't plan to solder their chips directly onto the motherboards.
“Intel remains committed to the growing desktop enthusiast and channel markets, and will continue to offer socketed parts in the LGA package for the foreseeable future for our customers and the Enthusiast DIY market. However, Intel cannot comment on specific long-term product roadmap plans at this time, but will disclose more details later per our normal communication process,” said Daniel Snyder, a spokesman for Intel, in a conversation with Maximum PC magazine.
We haven't seen the last of this of course, Intel can still easily start using BGA solutions in other markets, other solutions and along side current offerings but its good that they aren't up for abandoning their current format for the "foreseeable future", how ever long that may be.