While Intel have yet to comment on rumours that their future processor families will be provided in a soldered-down ball-grid array (BGA) package only, AMD has stepped forward to publicly state that it plans to support swappable CPUs for the foreseeable future.

Sources claim that Intel is to stop production of their land-grid array (LGA) processor packages in favour of using BGA packaging throughout their product ranges. Unlike LGA, which connects to the motherboard through a zero insertion force (ZIF) socket that allows the processor to be easily removed and replaced, BGA chips are permanently soldered to the board and cannot be removed without melting the solder.

'AMD has a long history of supporting the DIY and enthusiast desktop market with socketed CPUs and APUs that are compatible with a wide range of motherboard products from our partners,' AMD's Chris Hook has claimed in a statement to press. 'That will continue through 2013 and 2014 with the 'Kaveri' APU and FX CPU lines. We have no plans at this time to move to BGA only packaging and look forward to continuing to support this critical segment of the market.’

At present, AMD's statement is little more than trying to score points with system modder and builders: Intel has not formally stated that it has any such plans to remove LGA products from its roadmap

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