Leading manufacturers IBM, Samsung and GlobalFoundries have announced they will "unveil the future of silicon technology" at the 2012 Common Platform Technology Forum (CPTF).

The firms, who together create the largest chip-making consortium, will cover processes such as semi-conductor innovation, 28,20n and 14-nanometer processes, as well as innovations beyond 14nm and 450nm wafers.

This year's Common Platform Technology Forum will take place in Santa Clara Convention Center on March 14th, and Michael Cadigan, general manager of IBM's microelectronics division, said that the event is the ideal place to unveil the latest advancements in technology products.

He explained: "The Common Platform alliance is built upon an unmatched legacy of invention and deep commitment to research and development from IBM.

"The expertise of the companies is driving breakthrough technology innovations for semiconductor manufacturing.

"Our extensive and open ecosystem, focused on core manufacturing capabilities, gives our customers a flexible way to bring a wide range of semiconductor products to market."

IBM says the event will focus on how collaboration between parties can drive forward chip technology to produce new and exciting user experiences in the future.

Along with IBM, Samsung and GlobalFoundries, a further 20 additional companies are part of the Common Platform Alliance, between them accounting for the majority of the world's consumer electronics.

The group says the alliance ensures collective innovation and access to application–ready, leading–edge process technologies.

It also ensures that capacity that is synchronized while providing insurance against the risk of expensive redesign or manufacturing disruption.

The Common Platform Alliance recently collaborated with Mentor Graphics work on technology for a chip which "addresses many of the key challenges of IC design at advanced nodes".ADNFCR-1220-ID-801290248-ADNFCR
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