Memory manufacturer OCZ has released the Reaper CL4 4GB DDR2 memory kit with heat dispersal firmly in mind.

Aimed at enthusiasts looking to build a high-specification system, the kit includes a HPC heat spreader designed to keep the memory cool when used intensively.

OCZ explains: "As heat rises into the thermo-conductive copper heat pipe conduit, it is dissipated through the strategically-placed compact aluminium fin array."

When running at 800 MHz, the firm claims that the kit offers "unprecedented stability" on both AMD and Intel platforms.

"The Reaper HPC high-density 4GB kit offers consumers a robust product for gamers, system builders and case modders looking for a premium solution," comments vice-president of product management Jacky Huang.

Benefits of guiding heat away from the core memory modules include an increase in short-term performance and enhanced overall longevity, OCZ asserts.

The company recently introduced its Vanquisher CPU cooler with a pure copper base plate and three pipes, also of copper, to maximise the conduction of heat away from the processor.ADNFCR-1220-ID-18317557-ADNFCR
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